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Mold-Tek Packaging updates on QIP issue

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Capital Market
Last Updated : Feb 02 2015 | 1:32 PM IST

Bid closes on 30 January 2015; Issue price is Rs 220.17

Mold-Tek Packaging announced that in respect of the QIP, the QIP Committee (the "Committee") of the Company has at its meeting held on 30 January 2015, inter alia, approved the following:

1. Closure of the Bid on 30 January 2015;

2. The issue price of Rs. 220.17, after giving discount of upto 5% i.e. Rs. 11.58 per Equity Share, to the Floor Price of Rs. 231.75 per Equity Share as per the SEBI ICDR Regulations and shareholders' approval dated 24 December 2014, for the Equity Shares to be issued and allotted to eligible Qualified Institutional Buyers in the QIP; and

3. Approval of issue of Confirmation Allocation Note for the allocation of 24,98,350 Equity Shares to the Qualified Institutional Buyers.

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First Published: Feb 02 2015 | 12:30 PM IST

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