Cadence Unveils Clarity 3D Solver, Delivering Unprecedented Performance and Capacity for System Analysis and Design

/ -- Announcement marks Cadence's expansion into fast-growing system analysis and design market
Highlights:
The first product in Cadence's system analysis initiative, the Clarity 3D Solver delivers up to 10X faster performance for electromagnetic simulation with virtually unlimited capacity and gold-standard accuracy
New breakthrough architecture can run on hundreds of CPUs optimized for both cloud and on-premises distributed computing
True 3D model extraction eliminates risk from manually reducing the size of structures being modeled
Easily reads design data from all standard chip and IC package platforms and offers unique integration with Cadence implementation platforms

"At gigabit speeds on our highly dense PCBs with over 30 layers, we depend on accurate interconnect extraction of our complex structures to support signal integrity analysis," said Rick Burns, vice president of engineering, Semiconductor Test Division at Teradyne. "With the Cadence Clarity 3D Solver, we can achieve the necessary accuracy in a fraction of the time it has previously taken. This has opened up a new era of analysis possibilities for us since we can now run dozens of simulations in the time it has previously taken to run one. This reduces design re-spins and helps us fulfil our promise of delivering the highest throughput and lowest cost of test for our customers."

"As we move into the era of 'More than Moore', multi-physics simulations are becoming increasingly important to our future chip and system designs," said Catherine Xia, senior director of platform technology at HiSilicon. "Legacy 3D field solver technology has been incapable of meeting our requirements for simulating the entire system, including chip, package, PCB and enclosure. We are very excited to see the breakthrough performance and capacity introduced by the Cadence Clarity 3D Solver, and we look forward to more system-level simulation innovations from Cadence."
"Our newly formed System Analysis Group is breaking new ground on next-generation algorithms to solve the most difficult electromagnetic challenges across ICs, packages, boards and complete systems," said Tom Beckley, senior vice president and general manager of the Custom IC & PCB Group at Cadence. "This first major technology breakthrough, the Clarity 3D Solver, expands Cadence's product portfolio beyond traditional EDA-furthering our System Design Enablement strategy and enabling us to expand our system portfolio and market opportunities. With the Clarity 3D Solver, semiconductor and systems companies can address system-level problems for a broad spectrum of today's most challenging applications including 112G communication networks, IoT, automotive/ADAS, and other complex high-speed electronic systems."

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