The Union Cabinet on Wednesday cleared a comprehensive Rs 76,000-crore ($10-billion) package to build a much-needed semiconductor ecosystem in the country. The incentives will be extended to a range of new units -- greenfield chip fab and display fab units, apart from compound semiconductor and ATMP (assembly, testing, marking, and packaging) facilities.
The package also gives a fiscal push to the fledgling homegrown semiconductor product design companies (fabless players). And backing this effort is support to universities to train 85,000 engineers under the “chips to start-ups” programme.
Semiconductor and display fab units under the scheme will be offered financial support