Electronic packages fabricated at ITI Palakkad successfully flown in GSLV MkIII
ITI contributed to the manufacturing of electronic assembly for ISRO's GSLV MkIII, one of the prestigious missions of ISRO launched on 05 June 2017 to take a giant leap for India as a global space power.The electronic packages fabricated at ITI Palakkad were successfully flown in the GSLV MkIII. The packages of 12 nos. of Data Processing Units (DPU) V3L and 22 nos. of Remote Mount Safe Arm (RMSA) were used in the manufacturing of India's first development flight.
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